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55世纪新科明毅电子FPC填孔电镀设备，专为AI高阶软板填孔造程打造
Date: 2026-07-20　Click: 464
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伴随智能手机向端侧AI等方向升级，高阶FPC技术要求持续攀升，出产造备工艺正沿着更高厚径比的方向急剧演进 。


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在这一趋向下，FPC的厚径比需要逐步抬升，传统填孔电镀工艺的孔内填充质量与量产良率遭逢显著瓶颈，难以满足高阶FPC出产需要 。



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面对这一瓶颈，明毅电子自主研发的 FPC 填孔电镀设备——选取片式垂直陆续电镀工艺，搭载高喷流技术，可适配高阶软板填孔造程 。


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相比传统工艺规划，该设备以更高厚径比的填孔能力、更优的面铜均匀性、更靠得住的薄板走板阐发与更高的出产良率，可满足 AI 手机等终端对高阶软板的量产需要 。


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